STMicroelectronics unveils TFBGA-64 packages for STM32F101RB, STM32F103R8 and STM32F103R from its STM32 32-bit ARM Cortex MCU family

A growing number of applications have size constraints, notably for portable or tiny module applications. Die assembly is an option for some, but requires specific know-how and handling. To help designers overcome PCB size constraints, ST brings two new and simpler package options for its award winning STM32 microcontrollers. The TFBGA 64 features 8 x 8 balls with 0.5 mm pitch in only 5 mm x 5 mm and is available for all Performance line products (STM32F103) ranging from 16 Kbytes to 128 Kbytes of Flash. The WLCSP (wafer-level chip-scale package) features 8 x 8 balls with 0.5 mm pitch in only 4.5 mm x 4.5 mm and is available for all Performance line products ranging from 256 Kbytes to 512 Kbytes of Flash. Both are as simple to use as regular BGA packages, with a dimension that allows the most compact integrations.

This package is not meant to be for hobbyists, handling has its challenges, so does board layout but the reward is miniaturization to degree that was not possible with a high performance Cortex-M3 device of the shelve until now.

For evaluation of the device in its logical implementation the STM32 Primer2 can be used, which is based on an STM32F103 device.